Semiconductor
Advanced Material Solutions for Superior Performance and Reliability
Our high-performance materials are designed for the demanding requirements of semiconductor manufacturing, assembly and testing processes, ensuring excellent insulation, thermal management, contamination control and process stability.
High Purity & Low Contamination
Excellent Thermal Management
Electrical Insulation
Process Stability & High Reliability
Recommended Materials
PI Kapton® Film
High temperature resistance, excellent dielectric properties and dimensional stability.
Release Film
Smooth surface and low particle generation for easy release in lamination and protection processes.
High Temp Tape
Stable adhesion and residue-free removal for masking and protection during high temperature processes.
Silicone Pad
Excellent heat resistance and compression performance for wafer handling and thermal management.
Black PET Film
Anti-glare, high dimensional stability and electrical insulation for device protection.
Copper Foil & Tape
High conductivity and strong bonding performance for lead frame and EMI shielding applications.
Die Cut Parts
Precision die cutting for insulation, sealing, shielding and custom protection needs.
Key Benefits
Low Outgassing & Low Ionics
Minimize contamination and protect sensitive semiconductor devices.
High Temperature Resistance
Withstand harsh process environments from fabrication to testing.
Electrical Insulation & Safety
Excellent dielectric strength for reliable insulation protection.
Particle Control
Low particle generation to ensure yield and process stability.
Precision & Consistency
Tight tolerance and consistent quality for advanced semiconductor processes.
Improve Yield & Reliability
Reduce defects and enhance overall device performance and reliability.
Typical Applications
Wafer Back Grinding
Protective films and tapes for back grinding and wafer thinning.
Wafer Dicing
Dicing tape and UV release films for secure wafer mounting.
Packaging & Assembly
Insulation materials for chip packaging, bonding and encapsulation.
Testing & Burn-in
High temperature tapes and films for probe card and burn-in protection.
Etching & Deposition
Masking tapes and films for etching, plating and thin film processes.
CMP Process
Protective films and pads for CMP and surface polishing..
FPC & IC Substrate
Insulation films for flexible circuits and IC substrates.
Why Choose Us
- High purity raw materials and strict contamination control
- Advanced coating, slitting and precision die cutting
- Custom sizes and specifications available
- ISO certified quality management system
- Fast sampling, on-time delivery and global support
- Professional technical support and solution recommendation
